Silicon Wafer Cutting Machine with Fiber Laser Small Solar Panel Machine

Silicon Wafer Cutting Machine with Fiber Laser Small Solar Panel Machine

silicon wafer slicing machine with fiber laser little solar panel machine 

Parameters

 Model  XC-2000  CZPT power  30W
 Scriber precision  ≤±0.1mm  CZPT wavelength 1064nm
 Scriber line width  ≤40μm  capacity  1800 pcs/hour (1 cut)
 Maximum Scribing velocity  ≤600mm/s   solar mobile  156*156-166*166mm 
 Power  AC220V/50HZ/two.5KW    
 Cooling approach  Air-cooling

 

Traits

one. Sophisticated scribing technology

Undertake Raycus laser source, good good quality laser beam, slim laser scribing line, much more uniform solar cell cutting surface, tiny damage to solar mobile, large accuracy cutting.
 

2. Substantial effectiveness

Large laser scribing velocity, creating capacity can get to to 1800 total cells/hour.
 

3. Precision positioning

Solar cell full automated positioning, positioning accuracy ≤±0.1mm.
 

4. Higher automation degree

Photo voltaic mobile automatic loading and unloading, automatic positioning, computerized scribing.Steady functionality, low failure price, simple routine maintenance.

About creation line

We can supply the CZPT total creation line. The engineer can change the structure and overall performance of the generation line according to distinct requires of clients

 

Silicon Wafer Cutting Machine with Fiber Laser Small Solar Panel Machine

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